Asia Express - Mobile Communications
NTT DoCoMo Introduces New LSI Chip for Super 3G Mobile Phones
September 21, 2007
According to a press release by NTT DoCoMo, the company announced that it has developed a new LSI (Large-Scale Integration) chip based on the advanced signal processing technologies of MIMO (Multiple-Input Multiple-Output) and OFDM (Orthogonal Frequency Division Multiplexing). Featuring low power consumption and miniature size, DoCoMo's new LSI chip is designed for Super 3G or 3.9G mobile phones and beyond. According to the press release, this new chip achieved a transmission rate of 200Mbps and power consumption of less than 0.1W during the pilot run.